The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2021
Filed:
Jan. 16, 2018
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Yuki Inoue, Aizuwakamatsu, JP;
Kazunari Maki, Aizuwakamatsu, JP;
Shinichi Funaki, Aizuwakamatsu, JP;
Takashi Tamagawa, Naka, JP;
Kiyotaka Nakaya, Naka, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A terminal material for connectors, which is obtained by sequentially laminating on a substrate that is formed of copper or a copper alloy, a nickel or nickel alloy layer, a copper-tin alloy layer and a tin layer in this order, and: the tin layer has an average thickness of from 0.2 μm to 1.2 μm (inclusive); the copper-tin alloy layer is a compound alloy layer that is mainly composed of CuSn, with some of the copper in the CuSnbeing substituted by nickel, and has an average crystal grain diameter of from 0.2 μm to 1.5 μm (inclusive); a part of the copper-tin alloy layer is exposed from the surface of the tin layer, with the exposure area ratio being from 1% to 60% (inclusive); the nickel or nickel alloy layer has an average thickness of from 0.05 μm to 1.0 μm (inclusive) and an average crystal grain diameter of from 0.01 μm to 0.5 μm (inclusive).