The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
May. 02, 2019
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Assignee:
EBARA CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); G06T 7/00 (2017.01); G06K 9/62 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); G06K 9/6201 (2013.01); G06T 7/001 (2013.01); G06T 7/0006 (2013.01); H01L 22/26 (2013.01); G06T 2207/30148 (2013.01); H01L 2224/117 (2013.01); H01L 2224/11462 (2013.01);
Abstract
A device for inspecting a bump height includes an illumination device, an imaging device, and a control device. The illumination device irradiates a substrate with light. The substrate includes a resist and a bump formed on an opening portion of the resist. The imaging device images a pattern of the resist and the bump. The control device evaluates a height of the bump based on a luminance value of image data of the pattern obtained by the imaging device.
Okuzono, Takahisa. (2021). Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium (U.S. Patent No. 10910334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10910334
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