The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Jan. 24, 2019
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Anthony K. Stamper, Burlington, VT (US);
Daisy A. Vaughn, Stowe, VT (US);
Stephen R. Bosley, Essex Junction, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Assignee:
GLOBALFOUNDRIES U.S. INC., Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01); H01G 4/33 (2006.01); H01G 4/08 (2006.01); H01G 4/232 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01G 4/08 (2013.01); H01G 4/232 (2013.01); H01G 4/33 (2013.01); H01L 23/528 (2013.01); H01L 27/0805 (2013.01); H01L 28/40 (2013.01);
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material.