The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2021

Filed:

Jan. 21, 2019
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Shinji Wakabayashi, Nirasaki, JP;

Keisuke Kondoh, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B65G 49/07 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
B65G 49/07 (2013.01); H01L 21/67161 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67201 (2013.01); H01L 21/67775 (2013.01); H01L 21/67778 (2013.01);
Abstract

Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.


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