The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Oct. 13, 2015
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Martin Poelzl, Ossiach, AT;

Oliver Blank, Villach, AT;

Franz Hirler, Isen, DE;

Maximilian Roesch, St. Magdalen, AT;

Li Juin Yip, Villach, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 21/308 (2006.01); H01L 29/417 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/407 (2013.01); H01L 21/3086 (2013.01); H01L 29/404 (2013.01); H01L 29/41766 (2013.01); H01L 29/4236 (2013.01); H01L 29/66348 (2013.01); H01L 29/66719 (2013.01); H01L 29/66727 (2013.01); H01L 29/66734 (2013.01); H01L 29/7397 (2013.01); H01L 29/7813 (2013.01); H01L 29/0696 (2013.01); H01L 29/7811 (2013.01);
Abstract

First trenches extend from a process surface into a semiconductor layer. An alignment layer with mask pits in a with respect to the process surface vertical projection of the first trenches is formed on the process surface. Sidewalls of the mask pits have a smaller tilt angle with respect to the process surface than sidewalls of the first trenches. The mask pits are filled with an auxiliary material. A gate trench for a gate structure is formed in a mesa section of the semiconductor layer between the first trenches, wherein the auxiliary material is used as an etch mask.


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