logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10903137 B1

PDFFull Text
Date of Patent:
Jan. 26, 2021

Filed:

Aug. 14, 2019

Electrical interconnections with improved compliance due to stress relaxation and method of making

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Siddharth K. Alur, Chandler, AZ (US);

Sri Chaitra Jyotsna Chavali, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Niki H Nguyen

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/486 (2013.01); H01L 23/3675 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01);
Abstract

According to various embodiments of the present disclosure, an electrically conductive pillar having a substrate is disclosed. The electrically conductive pillar can comprise a first portion, second portion and a third portion. The first portion and/or third portion can be formed of an electrically conductive material that can be the same or different. The second portion can be intermediate and abut both the first portion and the third portion. The second portion can comprise a solder element formed of a second electrically conductive material that differs from the electrically conductive material and has a second stiffness less than a stiffness of the electrically conductive material.

Find Patent Forward Citations

Quick Actions:

Alur, Siddharth. (2021). Electrical interconnections with improved compliance due to stress relaxation and method of making (U.S. Patent No. 10903137). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10903137

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…