The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Jun. 08, 2015
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Satoshi Kamibayashi, Toyama, JP;

Hiroshi Ogino, Toyama, JP;

Tomoyuki Enomoto, Toyama, JP;

Kazuhiro Sawada, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 183/06 (2006.01); B32B 7/06 (2019.01); B32B 37/12 (2006.01); B32B 7/12 (2006.01); B32B 43/00 (2006.01); C09J 183/04 (2006.01); H01L 21/304 (2006.01); H01L 21/02 (2006.01); C09D 183/04 (2006.01); B32B 38/10 (2006.01); B32B 38/00 (2006.01); C09J 5/00 (2006.01); C08G 77/20 (2006.01); C08G 77/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 38/0008 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); C09D 183/04 (2013.01); C09J 5/00 (2013.01); C09J 183/04 (2013.01); C09J 183/06 (2013.01); H01L 21/02 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); B32B 2250/02 (2013.01); B32B 2383/00 (2013.01); B32B 2457/14 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C09J 2203/00 (2013.01); C09J 2301/502 (2020.08); C09J 2483/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01); Y10S 156/93 (2013.01); Y10T 156/11 (2015.01);
Abstract

A temporary adhesive is good peelability, heat resistance and cleaning removability after polishing of the rear surface of the wafer. A layered body for processing a rear surface of a wafer opposite to a circuit surface of the wafer, the layered body being a temporary adhesive loaded between a support and circuit surface of the wafer and including an adhesive layer (A) that includes a polyorganosiloxane to be cured by a hydrosilylation reaction and is releasably bonded, and a separation layer (B) includes a polyorganosiloxane and is releasably bonded, in which the polyorganosiloxane forming the separation layer (B) is a polyorganosiloxane containing a siloxane unit of RRSiO(provided that each R is bonded to a silicon atom as a Si—C bond), and at least one R is an aralkyl group, epoxy group, or phenyl group. Methods for producing and separating these layered bodies and composition for forming the separation layer.


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