The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2021

Filed:

Sep. 09, 2019
Applicant:

Carl Zeiss Smt Gmbh, Oberkochen, DE;

Inventors:

Jagdish Chandra Saraswatula, Singapore, SG;

Jens Timo Neumann, Aalen, DE;

Philipp Huethwohl, Ulm, DE;

Thomas Korb, Schwaebisch Gmuend, DE;

Raghavendra Hanumantha Nayak, Pleasanton, CA (US);

Assignee:

Carl Zeiss SMT GmbH, Oberkochen, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 19/402 (2006.01); H01L 23/544 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G05B 19/402 (2013.01); G06T 7/0006 (2013.01); G06T 7/0008 (2013.01); H01L 23/544 (2013.01); G05B 2219/45031 (2013.01); G05B 2219/49113 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54493 (2013.01);
Abstract

A method includes controlling a multi-scanning electron microscope, mSEM, to capture a first image of a wafer attached to a motorized handling stage while the motorized handling stage is in a first position. The first image includes at least a part of a notch of the wafer. The method also includes determining a radial axis of the wafer based on the first image, and controlling the motorized handling stage to shift the wafer along the radial axis by half a diameter of the wafer so that the motorized handling stage is in a second position. The method further includes controlling the mSEM to capture a second image of the wafer while the motorized handling stage is in the second position. The second image includes wafer structures. In addition, the method includes determining a reference position of the wafer based on a structure recognition of the wafer structures of the second image, and registering a wafer coordinate system of the wafer to a stage coordinate system of the motorized handling stage based on the reference position and the radial axis.


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