The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Sep. 17, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Scott B. Clendenning, Portland, OR (US);

Martin Mitan, Hillsboro, OR (US);

Aaron A. Budrevich, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 27/06 (2006.01); H01L 27/088 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823431 (2013.01); H01L 21/823412 (2013.01); H01L 27/0688 (2013.01); H01L 27/0886 (2013.01); H01L 29/41791 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

Methods for doping a subfin region of a semiconductor fin structure include forming a fin on a substrate; forming an oxide material on the substrate and a portion of the fin that corresponds to a sub-fin region of the fin; forming a hard mask on a top-fin region of the fin that is disposed above the sub-fin region; exposing a surface of the sub-fin region by removing the oxide material from a surface of the sub-fin region and leaving a layer of the oxide material on the substrate; depositing a dopant material on the hard mask, the surface of the subfin region, and the layer of the oxide material on the substrate; and removing the hard mask from the top-fin region to expose a surface of the top-fin region. Devices constructed using the disclosed methods are also provided, and other embodiments are discussed.


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