The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Aug. 17, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tetsuya Kitagawa, Nagasaki, JP;

Masayuki Kubota, Nagasaki, JP;

Motoyoshi Koyanagi, Nagasaki, JP;

Tomohito Taniuchi, Nagasaki, JP;

Daisuke Ikeda, Nagasaki, JP;

Kazuhiro Sasano, Nagasaki, JP;

Yuji Kobayashi, Nagasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0466 (2013.01); G01R 1/045 (2013.01);
Abstract

A semiconductor inspection jig includes: a base on which a semiconductor device is placed; and a substrate provided on the base and including a conductive pattern, wherein the conductive pattern intersects with a lead of the semiconductor device placed on the base from a direction other than a horizontal direction with respect to the lead, and is in contact with an intermediate part of the lead without being in contact with a leading end of the lead.


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