The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Jan. 17, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Han-Wen Chen, Cupertino, CA (US);
Steven Verhaverbeke, San Francisco, CA (US);
Giback Park, San Jose, CA (US);
Giorgio Cellere, Torri di Quartesolo, IT;
Diego Tonini, Treviso, IT;
Vincent DiCaprio, Pleasanton, CA (US);
Kyuil Cho, Santa Clara, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 25/10 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 21/486 (2013.01); H01L 21/4864 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/105 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1035 (2013.01);
Abstract
The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.