The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Jun. 03, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Chun-Jun Zhuang, Kaohsiung, TW;
Hsu-Nan Fang, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/566 (2013.01); H01L 23/3128 (2013.01); H01L 24/08 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/73253 (2013.01);
Abstract
A semiconductor package includes a redistribution layer (RDL) structure, a first die, a molding compound and an interconnect structure. The first die is disposed on the RDL structure. The molding compound is disposed on the RDL structure. The interconnect structure electrically connects the first die to the RDL structure.
Zhuang, Chun-Jun. (2021). Semiconductor package (U.S. Patent No. 10886223). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10886223
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile