The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Jan. 31, 2019
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Cheng-Lin Ho, Kaohsiung, TW;
Chih-Cheng Lee, Kaohsiung, TW;
Chun Chen Chen, Kaohsiung, TW;
Chen Yuang Chen, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H05K 1/181 (2013.01); H05K 3/341 (2013.01); H05K 2201/10446 (2013.01); H05K 2201/10522 (2013.01);
Abstract
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.