The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Feb. 22, 2019
Applicant:

Korea Institute of Science and Technology, Seoul, KR;

Inventors:

Hyung-jun Kim, Seoul, KR;

Sanghyeon Kim, Seoul, KR;

Hansung Kim, Seoul, KR;

Seong Kwang Kim, Seoul, KR;

Hyeong Rak Lim, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/683 (2006.01); H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); H01L 21/02463 (2013.01); H01L 21/02532 (2013.01); H01L 21/6835 (2013.01); H01L 21/7806 (2013.01); H01L 29/0649 (2013.01);
Abstract

A method for manufacturing a semiconductor device according to embodiments may include forming a sacrificial layer on a first substrate including first dopant atoms and second dopant atoms, and forming a germanium (Ge) layer on the sacrificial layer. Here, the germanium (Ge) layer may include the first dopant atoms diffused from the first substrate by growth temperature in the forming step. Additionally, the method for manufacturing a semiconductor device may further include annealing after growth of the germanium (Ge) layer so that the germanium (Ge) layer may include second dopant atoms.


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