The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Aug. 29, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chien-Huei Chen, Kaohsiung, TW;
Pei-Chao Su, Hsinchu County, TW;
Xiaomeng Chen, Hsinchu County, TW;
Chan-Ming Chang, Hsinchu, TW;
Shih-Yung Chen, Hsinchu, TW;
Hung-Yi Chung, Taoyuan, TW;
Kuang-Shing Chen, Hsinchu, TW;
Li-Jou Lee, Hsinchu, TW;
Yung-Cheng Lin, Hsinchu, TW;
Wei-Chen Wu, Hsinchu, TW;
Shih-Chang Wang, Hsinchu, TW;
Chien-An Lin, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.