The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Jan. 21, 2019
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Li-Hui Cheng, New Taipei, TW;
Chin-Fu Kao, Taipei, TW;
Chih-Yuan Chien, Hsinchu County, TW;
Szu-Wei Lu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 25/0652 (2013.01); H01L 25/071 (2013.01); H01L 25/112 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/32052 (2013.01); H01L 2224/32145 (2013.01);
Abstract
A package structure includes a substrate, a die, an adhesive layer, a dam structure, and an encapsulant. The die is disposed on the substrate. The adhesive layer is disposed between the substrate and the die. The adhesive layer has a curved surface. The dam structure is disposed on the substrate and surrounded by the adhesive layer. The encapsulant encapsulates the die.