The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Apr. 29, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Yung-Yao Lee, Hsinchu County, TW;
Wei-Hsiang Tseng, Hsinchu County, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/02 (2006.01); G01N 33/00 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
H01L 22/10 (2013.01); G01N 33/0031 (2013.01); G01N 33/0036 (2013.01); G03F 7/162 (2013.01); H01L 21/02282 (2013.01);
Abstract
A method for manufacturing a semiconductor structure is provided. The method includes the following operations. A first semiconductor substrate is provided on a spin chuck. A first humidity factor near the first semiconductor substrate is obtained. A resist material is dispensed on the first semiconductor substrate. The spin chuck is rotated at a first speed. The first speed is determined based on the first humidity factor.