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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10866524 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Dec. 18, 2019

Method and system for overlay control

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Yang-Hung Chang, Taipei, TW;

Chih-Ming Ke, Hsinchu, TW;

Kai-Hsiung Chen, New Taipei, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;

Attorney:

Haynes and Boone, LLP

Primary Examiner:

Phallaka Kik

Int. Cl.
CPC ...
G06F 17/50 (2006.01); G03F 7/00 (2006.01); G03F 9/00 (2006.01); G21K 5/00 (2006.01); H01L 21/00 (2006.01); G01R 31/26 (2020.01); G01P 21/00 (2006.01); G01N 37/00 (2006.01); G03F 7/20 (2006.01); G06F 30/398 (2020.01); G03F 1/00 (2012.01); G06F 111/04 (2020.01); G06F 111/10 (2020.01); G06F 111/20 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G06F 30/398 (2020.01); G01N 37/00 (2013.01); G01P 21/00 (2013.01); G01R 31/26 (2013.01); G03F 1/00 (2013.01); G03F 9/00 (2013.01); G06F 2111/04 (2020.01); G06F 2111/10 (2020.01); G06F 2111/20 (2020.01); G06F 2119/18 (2020.01); G21K 5/00 (2013.01); H01L 21/00 (2013.01);
Abstract

A method includes selecting a group of wafers, each of the wafers having a resist pattern; selecting a group of fields for each of the wafers; selecting one or more points on each of the fields; measuring overlay errors on the resist pattern at locations associated with the one or more points selected on the respective wafers; and generating a combined overlay correction map based on measurements of the overlay errors on the wafers. At least one of the selecting of the group of wafers, the selecting of the group of fields, and the selecting of the one or more points is based on a computer-generated model.

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Chang, Yang-Hung. (2020). Method and system for overlay control (U.S. Patent No. 10866524). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10866524

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