The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 2020

Filed:

May. 06, 2019
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Allen Timothy Chang, Hsinchu, TW;

Yi-Hsien Chang, Changhua County, TW;

Chun-Ren Cheng, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/447 (2006.01); C12Q 1/6869 (2018.01); B01L 3/00 (2006.01); B01F 13/00 (2006.01); G01N 21/05 (2006.01); G01N 21/64 (2006.01); G02B 6/122 (2006.01); G01N 21/03 (2006.01);
U.S. Cl.
CPC ...
C12Q 1/6869 (2013.01); B01F 13/0071 (2013.01); B01F 13/0076 (2013.01); B01L 3/502707 (2013.01); B01L 3/502792 (2013.01); G01N 21/05 (2013.01); G01N 21/6428 (2013.01); G01N 27/44721 (2013.01); G01N 27/44791 (2013.01); B01L 2300/0654 (2013.01); B01L 2300/089 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/0867 (2013.01); B01L 2300/165 (2013.01); B01L 2300/168 (2013.01); B01L 2400/0427 (2013.01); G01N 2021/0325 (2013.01); G01N 2021/058 (2013.01); G01N 2021/6482 (2013.01); G01N 2201/08 (2013.01); G02B 6/122 (2013.01);
Abstract

An integrated semiconductor device for manipulating and processing bio-entity samples and methods are described. The device includes a lower substrate, at least one optical signal conduit disposed on the lower substrate, at least one cap bonding pad disposed on the lower substrate, a cap configured to form a capped area, and disposed on the at least one cap bonding pad, a fluidic channel, wherein a first side of the fluidic channel is formed on the lower substrate and a second side of the fluidic channel is formed on the cap, a photosensor array coupled to sensor control circuitry, and logic circuitry coupled to the fluidic control circuitry, and the sensor control circuitry.


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