The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Jul. 12, 2017
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
ChunHung Chen, Hsinchu, TW;
Jung-Yu Li, Taichung, TW;
Sheng-Chen Wang, Taichung, TW;
Shih-Sian Huang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/10 (2012.01); B24B 37/22 (2012.01); B24B 37/24 (2012.01); B24B 37/26 (2012.01); B24B 53/017 (2012.01); B24B 37/005 (2012.01); B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
B24B 37/26 (2013.01); B24B 37/005 (2013.01); B24B 37/10 (2013.01); B24B 37/22 (2013.01); B24B 37/24 (2013.01); B24B 49/12 (2013.01); B24B 53/017 (2013.01);
Abstract
A polishing pad includes a first region having a first geometric property and a first material property. The polishing pad further includes a second region having a second geometric property and a second material property, wherein the second region is closer to an edge of the polishing pad than the first region. The first geometric property is different from the second geometric property; or the first material property is different from the second material property.