The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Feb. 22, 2019
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Tzyy-Jang Tseng, Taoyuan, TW;

Pei-Wei Wang, Taipei, TW;

Bo-Cheng Lin, Pingtung County, TW;

Chun-Hsien Chien, New Taipei, TW;

Chien-Chou Chen, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H01Q 3/38 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01Q 1/241 (2013.01); H01Q 1/38 (2013.01); H05K 1/0237 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 3/027 (2013.01); H05K 3/303 (2013.01); H05K 3/4015 (2013.01); H05K 3/4038 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 2201/10234 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.


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