The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Aug. 30, 2017
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Yung-Shun Chang, Kaohsiung, TW;

Teck-Chong Lee, Kaohsiung, TW;

Chien-Hua Chen, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/01 (2006.01); H01L 49/02 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 27/01 (2013.01); H01L 21/6835 (2013.01); H01L 28/10 (2013.01); H01L 28/60 (2013.01); H01L 2221/68345 (2013.01);
Abstract

An integrated passive component comprises a capacitor, a first passivation layer, an inductor, an insulation layer and an external contact. The first passivation layer surrounds the capacitor. The inductor is on the first passivation layer and electrically connected to the capacitor. The inductor comprises a plurality of conductive pillars. The insulation layer is on the first passivation layer and surrounds each of the conductive pillars. The insulation layer comprises a first surface adjacent to the first passivation layer, a second surface opposite to the first surface, and a side surface extending between the first surface and the second surface. A ratio of a width of each of the conductive pillars to a height of each of the conductive pillars is about 1:7. The external contact is electrically connected to the inductor and contacts the second surface of the insulation layer and the side surface of the insulation layer.


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