The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 08, 2020

Filed:

Sep. 26, 2018
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Chien-Ying Sun, Tainan, TW;

En-Chiuan Liou, Tainan, TW;

Yu-Cheng Tung, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/302 (2006.01); H01J 37/317 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3026 (2013.01); H01J 37/3174 (2013.01); H01J 2237/30433 (2013.01); H01J 2237/31769 (2013.01); H01J 2237/31776 (2013.01); H01L 21/0277 (2013.01);
Abstract

A method of pattern data preparation includes the following steps. A desired pattern to be formed on a surface of a layer is inputted. A first set of beam shots are determined, and a first calculated pattern on the surface is calculated from the first set of beam shots. The first calculated pattern is rotated, so that a boundary of the desired pattern corresponding to a non-smooth boundary of the first calculated pattern is parallel to a boundary constituted by beam shots. A second set of beam shots are determined to revise the non-smooth boundary of the first calculated pattern, thereby calculating a second calculated pattern being close to the desired pattern on the surface. The present invention also provides a method of forming a pattern in a layer.


Find Patent Forward Citations

Loading…