The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Mar. 01, 2018
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Yu Ishii, Tokyo, JP;
Kenya Ito, Tokyo, JP;
Keisuke Uchiyama, Tokyo, JP;
Masayuki Nakanishi, Tokyo, JP;
Assignee:
EBARA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/461 (2006.01); H01L 21/68 (2006.01); B24B 37/10 (2012.01); B24B 37/005 (2012.01); G06F 9/06 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/461 (2013.01); B24B 37/005 (2013.01); B24B 37/107 (2013.01); G06F 9/06 (2013.01); H01L 21/02096 (2013.01); H01L 21/68 (2013.01);
Abstract
A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.