The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Dec. 12, 2018
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Tsutomu Tanaka, Santa Clara, CA (US);
Dmitry A. Dzilno, Sunnyvale, CA (US);
Alexander V. Garachtchenko, Mountain View, CA (US);
Keiichi Tanaka, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01J 37/32 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01); H01L 21/687 (2006.01); C23C 16/455 (2006.01); C23C 16/505 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32174 (2013.01); C23C 16/45525 (2013.01); C23C 16/505 (2013.01); H01J 37/32449 (2013.01); H01J 37/32715 (2013.01); H01J 37/32743 (2013.01); H01J 37/32752 (2013.01); H01J 37/32788 (2013.01); H01J 37/32899 (2013.01); H01L 21/0228 (2013.01); H01L 21/0262 (2013.01); H01L 21/02274 (2013.01); H01L 21/28556 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/20285 (2013.01); H01J 2237/332 (2013.01);
Abstract
Apparatus and methods of processing a substrate in a plasma enhanced spatial atomic layer deposition chamber. A substrate is moved through one or more plasma processing regions and one or more non-plasma processing regions while the plasma power is pulsed to prevent a voltage differential on the substrate from exceeding a breakdown voltage of the substrate or device being formed on the substrate.