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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10851267 B1

PDFFull Text
Date of Patent:
Dec. 01, 2020

Filed:

Mar. 06, 2019

Polishing composition

Applicant:

Fujimi Incorporated, Kiyosu, JP;

Inventors:

Yukinobu Yoshizaki, Kiyosu, JP;

Youhei Takahashi, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Shamim Ahmed

Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 13/00 (2006.01); H01L 21/306 (2006.01); C09K 3/14 (2006.01); H01L 21/321 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C09K 3/1409 (2013.01); C09K 3/1436 (2013.01); H01L 21/30625 (2013.01); H01L 21/31055 (2013.01); H01L 21/3212 (2013.01);
Abstract

Polishing compositions are disclosed which contribute to improvement of level difference performance (in particular, erosion). The polishing composition used for polishing an object to be polished includes abrasive grains and a dispersing medium, wherein the abrasive grains have an average primary particle size of 40 nm or less, and the number of coarse particles having a particle size of 0.2 to 1,600 μm in the abrasive grains is 20,000 or less per 1 cmof the polishing composition.

Find Patent Forward Citations

Yoshizaki, Yukinobu. (2020). Polishing composition (U.S. Patent No. 10851267). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10851267

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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