The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Sep. 26, 2018
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

Morgan D. Evans, Manchester, MA (US);

Kevin Anglin, Somerville, MA (US);

Ross Bandy, Milton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 23/00 (2006.01); H01L 21/285 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28506 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01J 2237/30433 (2013.01); H01J 2237/30472 (2013.01); H01J 2237/31 (2013.01); H01J 2237/3151 (2013.01);
Abstract

Methods for processing of a workpiece are disclosed. The actual rate at which different portions of an ion beam can process a workpiece, referred to as the processing rate profile, is determined by measuring the amount of material removed from, or added to, a workpiece by the ion beam as a function of ion beam position. An initial thickness profile of a workpiece to be processed is determined. Based on the initial thickness profile, a target thickness profile, and the processing rate profile of the ion beam, a first set of processing parameters are determined. The workpiece is then processed using this first set of processing parameters. In some embodiments, an updated thickness profile is determined after the first process and a second set of processing parameters are determined. A second process is performed using the second set of processing parameters. Optimizations to improve throughput are also disclosed.


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