The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Jan. 25, 2016
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Wataru Shibayama, Toyama, JP;

Makoto Nakajima, Toyama, JP;

Yuichi Goto, Toyama, JP;

Rikimaru Sakamoto, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); G03F 7/40 (2006.01); G03F 7/075 (2006.01); C08G 77/18 (2006.01); C08G 77/28 (2006.01); G03F 7/09 (2006.01); C08G 77/14 (2006.01); H01L 21/033 (2006.01); C08G 77/00 (2006.01); C09D 183/08 (2006.01); C08G 77/44 (2006.01); C08G 77/08 (2006.01); G03F 7/20 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/091 (2013.01); C08G 77/08 (2013.01); C08G 77/14 (2013.01); C08G 77/18 (2013.01); C08G 77/28 (2013.01); C08G 77/44 (2013.01); C08G 77/80 (2013.01); C09D 183/08 (2013.01); G03F 7/0752 (2013.01); G03F 7/2041 (2013.01); G03F 7/40 (2013.01); H01L 21/0276 (2013.01); H01L 21/0332 (2013.01);
Abstract

A resist underlayer film forming composition for lithography for forming a resist underlayer film that can be used as a hard mask, including: a hydrolyzable silane, a hydrolysis product thereof, a hydrolysis condensate thereof, or a combination thereof as a silane, wherein the hydrolyzable silane includes at least one hydrolyzable silane selected from the group made of hydrolyzable silanes of Formula (1), Formula (2), and Formula (3): A method for producing a semiconductor device including: forming an organic underlayer film on a semiconductor substrate; applying the resist underlayer film forming composition onto the organic underlayer film and baking the composition to form a resist underlayer film; applying a resist film forming composition onto the resist underlayer film to form a resist film; exposing the resist film to light; developing the resist film after exposure to obtain a resist pattern; and etching in this order.


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