The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Jan. 23, 2019
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Alessandro Calderoni, Boise, ID (US);

Beth R. Cook, Boise, ID (US);

Durai Vishak Nirmal Ramaswamy, Boise, ID (US);

Ashonita A. Chavan, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11509 (2017.01); H01G 4/008 (2006.01); H01G 4/06 (2006.01); H01G 4/40 (2006.01); H01L 49/02 (2006.01); H01L 27/11504 (2017.01); G11C 11/22 (2006.01); H01L 27/11507 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11509 (2013.01); G11C 11/221 (2013.01); G11C 11/2295 (2013.01); H01G 4/008 (2013.01); H01G 4/06 (2013.01); H01G 4/40 (2013.01); H01L 27/11504 (2013.01); H01L 27/11507 (2013.01); H01L 28/55 (2013.01); H01L 28/60 (2013.01);
Abstract

Some embodiments include an integrated assembly having first electrodes with top surfaces, and with sidewall surfaces extending downwardly from the top surfaces. The first electrodes are solid pillars. Insulative material is along the sidewall surfaces of the first electrodes. Second electrodes extend along the sidewall surfaces of the first electrodes and are spaced from the sidewall surfaces by the insulative material. Conductive-plate-material extends across the first and second electrodes, and couples the second electrodes to one another. Leaker-devices electrically couple the first electrodes to the conductive-plate-material and are configured to discharge at least a portion of excess charge from the first electrodes to the conductive-plate-material. Some embodiments include methods of forming integrated assemblies.


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