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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10832999 B1

PDFFull Text
Date of Patent:
Nov. 10, 2020

Filed:

Dec. 26, 2019

Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Kuei-Wei Huang, Hsinchu, TW;

Wei-Hung Lin, Xinfeng Township, TW;

Chih-Wei Lin, Zhubei, TW;

Chun-Cheng Lin, New Taipei, TW;

Meng-Tse Chen, Changzhi Township, TW;

Ming-Da Cheng, Taoyuan, TW;

Chung-Shi Liu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Matthew E Gordon

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/561 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 24/97 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01);
Abstract

Packaging methods for semiconductor devices are disclosed. A method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.

Find Patent Forward Citations

Huang, Kuei-Wei. (2020). Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates (U.S. Patent No. 10832999). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10832999

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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