The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Mar. 06, 2017
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yoichiro Chiba, Nirasaki, JP;

Daisuke Suzuki, Nirasaki, JP;

Kazuhide Hasebe, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C30B 1/02 (2006.01); C23C 16/04 (2006.01); C23C 16/24 (2006.01); C23C 16/56 (2006.01); C23C 16/06 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01); C30B 29/06 (2006.01); C30B 29/08 (2006.01); C30B 29/52 (2006.01); C30B 29/68 (2006.01);
U.S. Cl.
CPC ...
C30B 1/026 (2013.01); C23C 16/045 (2013.01); C23C 16/06 (2013.01); C23C 16/24 (2013.01); C23C 16/458 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); C30B 29/06 (2013.01); C30B 29/08 (2013.01); C30B 29/52 (2013.01); C30B 29/68 (2013.01);
Abstract

A method of growing a crystal in a recess in a substrate on which an insulating film having the recess is formed, includes: forming a first film on the insulating film at a thickness as not to completely fill the recess; etching the first film by an etching gas to remain the first film only in a bottom portion of the recess; annealing the substrate such that the first film in the bottom portion is modified into a crystalline layer; forming a second film on the insulating film and a surface of the crystalline layer at a thickness as not to completely fill the recess; annealing the substrate such that the second film is crystallized from the bottom portion through a solid phase epitaxial growth to form an epitaxial crystal layer; and etching and removing the second film remaining on the substrate by an etching gas.


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