The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Nov. 20, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Telesphor Kamgaing, Chandler, AZ (US);

Georgios Dogiamis, Chandler, AZ (US);

Henning Braunisch, Phoenix, AZ (US);

Hyung-Jin Lee, Portland, OR (US);

Richard Dischler, Bolton, MA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 15/04 (2006.01); H04B 3/52 (2006.01); H04B 1/52 (2015.01); H04B 3/56 (2006.01); H04B 1/525 (2015.01);
U.S. Cl.
CPC ...
H04B 15/04 (2013.01); H04B 1/52 (2013.01); H04B 1/525 (2013.01); H04B 3/52 (2013.01); H04B 3/56 (2013.01);
Abstract

Embodiments may relate to a transceiver chip. The transceiver chip may include a substrate that has a first transceiver component and a second transceiver component positioned therein. The transceiver chip may further include a well material that is positioned between the first transceiver component and the second transceiver component. The well material may mitigate cross-talk between the first transceiver component and the second transceiver component. Other embodiments may be described or claimed.


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