The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Jan. 25, 2019
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Materials Co., Ltd., Yokohama-shi Kanagawa, JP;

Inventors:

Hiromasa Kato, Nagareyama Chiba, JP;

Takashi Sano, Fujisawa Kanagawa, JP;

Assignees:

KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;

TOSHIBA MATERIALS CO., LTD., Yokohama-Shi, Kanagawa-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/36 (2006.01); H01L 23/13 (2006.01); B23K 1/00 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); B23K 1/0016 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H05K 1/0201 (2013.01); H05K 1/0306 (2013.01); H05K 3/202 (2013.01);
Abstract

A circuit board includes: a ceramic substrate that has a first surface and a second surface; a first metal part that has a first metal plate joined to the first surface and a protrusion projecting from a front surface of the first metal plate; and a second metal part that has a second metal plate joined to the second surface. When the ceramic substrate is equally divided into first to third sections along a longer side direction, V, V, V, V, V, and Vare numbers satisfying formula V/V+V/V≤2(V/V), 0.5≤V/V≤2, 0.5≤V/V≤2, and 0.5≤V/V≤2.


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