The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2020

Filed:

Aug. 24, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuichiro Wagatsuma, Nirasaki, JP;

Miyako Kaneko, Nirasaki, JP;

Naotaka Noro, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/285 (2006.01); C23C 16/458 (2006.01); C23C 16/44 (2006.01); C23C 16/34 (2006.01); C23C 16/24 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28556 (2013.01); C23C 16/24 (2013.01); C23C 16/34 (2013.01); C23C 16/345 (2013.01); C23C 16/4404 (2013.01); C23C 16/4581 (2013.01); H01L 21/28568 (2013.01);
Abstract

There is provided a film-forming method, including: a pre-coating process of supplying a first gas containing silicon into a processing container in which a substrate is not loaded, and coating surfaces of members installed inside the processing container, including a mounting table configured to mount the substrate thereon, with a film made of silicon; subsequently, a mounting process of mounting the substrate on the mounting table so that a back surface of the substrate is in contact with the film made of silicon; and subsequently, a film-forming process of supplying a second gas containing an organometallic compound into the processing container, and forming a film made of a metal constituting the organometallic compound on the substrate.


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