The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Apr. 22, 2019
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hsin-Hsiang Tseng, Changhua County, TW;

Chih-Fei Lee, Tainan, TW;

Chia-Pin Cheng, Kaohsiung, TW;

Fu-Cheng Chang, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0216 (2014.01); H01L 31/0232 (2014.01); H01L 27/146 (2006.01); H01L 31/112 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02162 (2013.01); H01L 27/14643 (2013.01); H01L 27/14683 (2013.01); H01L 31/0232 (2013.01); H01L 31/1125 (2013.01); Y02E 10/50 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method of forming a semiconductor device includes forming a photo sensing region in a semiconductor substrate, wherein the semiconductor substrate is of a first type dopant and the photo sensing region is of a second type dopant that has a different conductivity type than the first type dopant; forming a nanostructure layer in contact with an interface between the photo sensing region and the semiconductor substrate; and etching the nanostructure layer until exposing the photo sensing region to form a plurality of nanostructures.


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