The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 2020

Filed:

Aug. 19, 2014
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Yuki Munetaka, Tokyo, JP;

Kazuo Ogawa, Tokyo, JP;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 27/088 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7827 (2013.01); H01L 21/823487 (2013.01); H01L 27/088 (2013.01); H01L 29/4238 (2013.01); H01L 29/42356 (2013.01); H01L 29/66666 (2013.01); H01L 29/0653 (2013.01);
Abstract

A semiconductor device includes an active region which is surrounded by a device isolation region on a semiconductor substrate and which extends in a first direction; a silicon pillar which separates the active region along the first direction into a first lower diffusion layer and a second lower diffusion layer; a first gate electrode covering a first side face of the silicon pillar which is located on a side of the first lower diffusion layer; a second gate electrode covering a second side face of the silicon pillar which is located on a side of the second lower diffusion layer; a conductive layer provided on a top face of the silicon pillar; and a device isolation insulating film contacting with a third side face of the silicon pillar which is different from the first side face and the second side face.


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