The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Dec. 07, 2017
Tessera, Inc., San Jose, CA (US);
Cyprian Emeka Uzoh, San Jose, CA (US);
Vage Oganesian, Palo Alto, CA (US);
Ilyas Mohammed, Santa Clara, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
In interconnect fabrication (e.g. a damascene process), a barrier layer (possibly conductive) is formed over a substrate with holes, a conductor is formed over the barrier layer, and the conductor and the barrier layer are polished to expose the substrate around the holes and provide interconnect features in the holes. To prevent erosion/dishing of the conductor over the holes, the conductor is covered by another, 'first' layer before polishing; then the first layer, the conductor, and the barrier layer are polished to expose the substrate. The first layer may or may not be conductive. The first layer protects the conductor to reduce or eliminate the conductor erosion/dishing over the holes.