The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Dec. 12, 2018
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chao-Hsiung Yeh, Changhua County, TW;
Hsuan Chang, Taichung, TW;
Jen-Ti Wang, Taichung, TW;
Chin-Tsan Chen, Taichung, TW;
Kuo-Fong Chuang, Taoyuan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.