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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10797005 B1

PDFFull Text
Date of Patent:
Oct. 06, 2020

Filed:

Feb. 21, 2018

Semiconductor package and method for manufacturing the same

Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chen-Shien Chen, Hsinchu County, TW;

Ming-Da Cheng, Hsinchu County, TW;

Ming-Chih Yew, Hsinchu, TW;

Yu-Tse Su, Chiayi, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;

Attorneys:

WPAT, P.C., Intellectual Property Attorneys

Anthony King

Primary Examiner:

Ajay Arora

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/52 (2006.01); H01L 27/02 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/6835 (2013.01); H01L 23/49827 (2013.01); H01L 23/52 (2013.01); H01L 23/5389 (2013.01); H01L 24/95 (2013.01); H01L 27/0203 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68354 (2013.01); H01L 2224/18 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor package includes a die including a first surface and a second surface opposite to the first surface, a warpage control unit disposed over the second surface of the die and entirely overlapping the second surface of the die, and a molding compound surrounding the die and the warpage control unit. The warpage control unit includes an adhesive portion disposed over the second surface of the die and a warpage adjustable portion sandwiched between the adhesive portion and the die.

Find Patent Forward Citations

Chen, Chen-Shien. (2020). Semiconductor package and method for manufacturing the same (U.S. Patent No. 10797005). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10797005

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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