The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Nov. 07, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Fen Chen, Williston, VT (US);

Mukta G. Farooq, Hopewell Junction, VT (US);

John A. Griesemer, Salt Point, NY (US);

Chandrasekaran Kothandaraman, Hopewell Junction, NY (US);

John M. Safran, Wappingers Falls, NY (US);

Timothy D. Sullivan, Underhill, VT (US);

Ping-Chuan Wang, Hopewell Junction, NY (US);

Lijuan Zhang, Beacon, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/08 (2020.01); H01L 23/48 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/08 (2013.01); G01R 31/2858 (2013.01); H01L 22/34 (2013.01); H01L 23/481 (2013.01); G01R 31/2856 (2013.01); H01L 22/14 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An EM testing method includes forcing electrical current through EM monitor wiring arranged in close proximity to the perimeter of the TSV and measuring an electrical resistance drop across the EM monitor wiring. The method may further include determining if an electrical short exists between the EM monitor wiring and the TSV from the measured electrical resistance. The method may further include determining if an early electrical open or resistance increase exists within the EM monitoring wiring due to TSV induced proximity effect.


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