The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2020

Filed:

Jan. 18, 2016
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kuniaki Yamaguchi, Tokyo, JP;

Itsuki Kobata, Tokyo, JP;

Toshio Mizuno, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); B24B 37/10 (2012.01); B24B 49/16 (2006.01); B24B 37/34 (2012.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/10 (2013.01); B24B 37/34 (2013.01); B24B 49/16 (2013.01); H01L 21/30625 (2013.01); H01L 22/20 (2013.01);
Abstract

The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed. One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.


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