The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Aug. 08, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Guangjun Yang, Meridian, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/764 (2006.01); H01L 21/02 (2006.01); H01L 27/108 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/764 (2013.01); H01L 21/02164 (2013.01); H01L 21/02266 (2013.01); H01L 21/32105 (2013.01); H01L 27/10876 (2013.01); H01L 27/10882 (2013.01); H01L 27/10885 (2013.01); H01L 27/10888 (2013.01);
Abstract
Some embodiments include a method of forming an integrated assembly. A construction is formed to include a structure having an exposed surface, and to include an opening proximate the structure. An aperture extends into the opening. A first material is deposited to form a mass along the exposed surface of the structure. Particles are sputtered from the mass and across the aperture. The particles agglomerate to form a sealant material which traps a void within the opening.