The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jun. 18, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Sanjay C. Mehta, Niskayuna, NY (US);

Alexander Reznicek, Troy, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 29/45 (2006.01); H01L 21/8234 (2006.01); H01L 29/66 (2006.01); H01L 21/283 (2006.01); H01L 29/08 (2006.01); H01L 21/02 (2006.01); H01L 29/04 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 21/02167 (2013.01); H01L 21/283 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 29/045 (2013.01); H01L 29/0847 (2013.01); H01L 29/45 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A semiconductor structure includes a plurality of semiconductor material fins located on a surface of a substrate. At least one gate structure straddles over a portion of each semiconductor material fin. Unmerged source-side epitaxial semiconductor material portions are located on an exposed surfaces of each semiconductor material fin and on one side of each gate structure and unmerged drain-side epitaxial semiconductor portions are located on other exposed surfaces of each semiconductor material fin and on another side of each gate structure. An etch stop structure is located between each unmerged source-side and drain-side epitaxial semiconductor material portions. Each etch stop structure includes a bottom material portion that has a higher etch resistance in a specific etchant as compared to an upper material portion of the etch stop structure.


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