The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Nov. 30, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Benjamin D. Briggs, Waterford, NY (US);

Lawrence A. Clevenger, Rhinebeck, NY (US);

Bartlet H. Deprospo, Goshen, NY (US);

Huai Huang, Saratoga Springs, NY (US);

Christopher J. Penny, Saratoga Springs, NY (US);

Michael Rizzolo, Albany, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/7684 (2013.01); H01L 21/76802 (2013.01); H01L 21/76829 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 23/5222 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53295 (2013.01); H01L 21/76826 (2013.01); H01L 21/76832 (2013.01); H01L 21/76883 (2013.01); H01L 21/76897 (2013.01);
Abstract

A conductive line structure comprises a first conductive line arranged in a first dielectric layer, a second conductive line arranged in the first dielectric layer, a cap layer arranged on the first conductive line and the second conductive line, and an airgap arranged between the first conductive line and the second conductive line, the airgap defined by the first dielectric layer and the cap layer.


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