The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2020

Filed:

Feb. 15, 2019
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Tsuyoshi Araoka, Matsumoto, JP;

Mitsuo Okamoto, Tsukuba, JP;

Yohei Iwahashi, Tsukuba, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 21/02 (2006.01); H01L 29/94 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 21/022 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02219 (2013.01); H01L 21/02255 (2013.01); H01L 21/02274 (2013.01); H01L 21/02337 (2013.01); H01L 21/02378 (2013.01); H01L 29/6606 (2013.01); H01L 29/94 (2013.01);
Abstract

A silicon nitride film having a thickness in a range from 1 [nm] to 3 [nm] is deposited on a front surface of a silicon carbide semiconductor base, by an ALD method. Next, on the silicon nitride film, for example, a silicon oxide film having a thickness in a range from 20 [nm] to 100 [nm] is deposited. After deposition of the silicon oxide film, for example, heat treatment is performed at a temperature in a range from 1100 degrees C. to 1350 degrees C., in a gas atmosphere that includes oxygen. By this heat treatment, nitrogen surface density of an interface of the silicon carbide semiconductor base and the silicon oxide film (gate insulating film) is increased, reducing interface state density of the interface of the silicon carbide semiconductor base and the silicon nitride film.


Find Patent Forward Citations

Loading…