The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Mar. 22, 2018
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Purakh Raj Verma, Singapore, SG;

Su Xing, Singapore, SG;

Ching-Yang Wen, Pingtung County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 27/12 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 29/786 (2006.01); H01L 29/417 (2006.01); H01L 23/522 (2006.01); H01L 21/84 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/84 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 27/1203 (2013.01); H01L 27/1207 (2013.01); H01L 29/41733 (2013.01); H01L 29/78615 (2013.01); H01L 29/78618 (2013.01); H01L 29/78696 (2013.01);
Abstract

A semiconductor device includes a buried insulation layer, a semiconductor layer, a gate structure, a source doped region, and a drain doped region. The semiconductor layer is disposed on the buried insulation layer. The gate structure is disposed on the semiconductor layer. The semiconductor layer includes a body region disposed between the gate structure and the buried insulation layer. The source doped region and the drain doped region are disposed in the semiconductor layer. A first contact structure penetrates the buried insulation layer and contacts the body region. A second contact structure penetrates the buried insulation layer and is electrically connected with the source doped region. At least a part of the first contact structure overlaps the body region in a thickness direction of the buried insulation layer. The body region is electrically connected with the source doped region via the first contact structure and the second contact structure.


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