The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Mar. 18, 2019
Stmicroelectronics, Inc., Coppell, TX (US);
Stmicroelectronics Internaitonal N.v., Amsterdam, NL;
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Simon Dodd, West Linn, OR (US);
David S. Hunt, San Diego, CA (US);
Joseph Edward Scheffelin, San Diego, CA (US);
Dana Gruenbacher, Fairfield, OH (US);
Stefan H. Hollinger, Kronberg im Taunus, DE;
Uwe Schober, Schlossborn, DE;
Peter Janouch, Frankfurt, DE;
STMICROELECTRONICS S.r.l., Agrate Brianza, IT;
STMICROELECTRONICS, INC., Coppell, TX (US);
STMICROELECTRONICS INTERNATIONAL N.V., Schiphol, NL;
Abstract
The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.