The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Dec. 12, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Yu Chao Lin, Hsinchu, TW;

Chao-Cheng Chen, Hsin-Chu, TW;

Chun-Hung Lee, Hsinchu, TW;

Yu-Lung Yang, Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0338 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/3086 (2013.01); H01L 21/31144 (2013.01); H01L 21/32139 (2013.01); H01L 21/0234 (2013.01); H01L 21/02326 (2013.01); H01L 21/30655 (2013.01); H01L 21/31116 (2013.01);
Abstract

A method includes forming mandrel patterns over a substrate; depositing a spacer layer over the mandrel patterns and onto sidewalls of the mandrel patterns; trimming the spacer layer to reduce a thickness of the spacer layer along a pattern width direction; and etching the spacer layer to expose the mandrel patterns, resulting in a patterned spacer layer on the sidewalls of the mandrel patterns. The trimming of the spacer layer and the etching of the spacer layer are performed in separate processes. After the trimming of the spacer layer and the etching of the spacer layer, the method further includes removing the mandrel patterns.


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