The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Mar. 04, 2019
Applicant:

Elpis Technologies Inc., Ottawa, CA;

Inventors:

Michael P. Belyansky, Halfmoon, NY (US);

Andrew Greene, Albany, NY (US);

Fee Li Lie, Albany, NY (US);

Huimei Zhou, Albany, NY (US);

Assignee:

ELPIS TECHNOLOGIES INC., Ottawa, Ontario, CA;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/062 (2012.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 21/762 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/161 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66545 (2013.01); H01L 21/76224 (2013.01); H01L 21/76229 (2013.01); H01L 21/823425 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 21/823468 (2013.01); H01L 29/0665 (2013.01); H01L 29/161 (2013.01); H01L 29/6656 (2013.01); H01L 29/66553 (2013.01); H01L 29/66795 (2013.01); H01L 29/66818 (2013.01); H01L 29/7831 (2013.01);
Abstract

A semiconductor structure includes a substrate, a plurality of parallel fins extending above the substrate, a plurality of gate structures perpendicular to the plurality of fins and including a plurality of sidewall spacers, and a plurality of source-drain regions intermediate the plurality of gate structures. A liner of a silicon-containing material is deposited over outer surfaces of the plurality of gate structures; over the liner, an inter-layer dielectric material is deposited. The semiconductor substrate with the deposited liner of silicon-containing material and deposited inter-layer dielectric material is annealed to at least partially consume the liner of silicon-containing material into the inter-layer dielectric material, to control residual stress such that resultant gate structures following the annealing have an aspect ratio range of 3:1 to 10:1, and are uniform in range to within seven percent of a target critical dimension.


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