The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Feb. 22, 2017
Applicant:

Lam Research Corporation, Frement, CA (US);

Inventors:

Fangli Hao, Cupertino, CA (US);

Yuehong Fu, Fremont, CA (US);

Zhigang Chen, Campbell, CA (US);

Assignee:

LAM RESEARCH CORPORATION, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01T 23/00 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01J 37/32477 (2013.01); H01J 37/32623 (2013.01); H01J 37/32715 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01);
Abstract

A substrate support includes a baseplate, a ceramic layer arranged on the baseplate, a bond layer arranged in a first gap between the baseplate and the ceramic layer, a channel formed through the baseplate, the bond layer, and the ceramic layer, and a plug arranged in the channel. The plug includes a lower portion arranged in the baseplate and an upper portion arranged in the ceramic layer. The lower portion includes a pocket and sidewalls surrounding the pocket. The upper portion extends below the ceramic layer and the first gap into the pocket, the sidewalls of the lower portion overlap the upper portion, and a second gap between the upper portion and the lower portion is located within the pocket of the lower portion below the first gap.


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